UINT electronic team, with its knowledge of electronics related to smartcard integration is able to design and develop the specific circuit needed for your interfaces and applications.
As usually, a printed circuit board, or PCB, is used to mechanically support and electrically connect active and passive components using conductive pathways or via holes, etched from copper sheets laminated onto an insulating substrate ( Polyimide, P.E.N., P.E.T……); our specificity and advantages come from our ability in mastering the thinnest components available to date on flexible PCBs (flex).
After the printed circuit board (PCB) is completed, all components must be mounted and connected to form a functional circuit.
In through-hole construction, component leads are inserted in holes. In surface-mount construction, the components are placed on pads on the outer surfaces of the PCB.
In both kinds of assembly, component leads are electrically and mechanically fixed to the board with a molten metal solder or glue. UINT is able to manage all the Wire Bounding Techniques (Ball, Wedge, Bump) for both chip to chip and chip to board connections.
The UINT assembling techniques are fully compatible with very high volume production.
After the board has been populated it may be tested in a variety of ways (visual inspection and/or automated optical inspection, physical/electrical measurements, functional test)
A laminate is a material constructed by uniting two or more layers of material together. The process of creating a laminate is lamination which, in common parlance refers to the sandwiching of something between layers of plastic and sealing them with heat or pressure.
However, in UINT electrical engineering, lamination is a construction technique used to prevent of unwanted heating effects due to eddy currents in components.
UINT powered electronic boards may be laminate through Cold, Warm or Hot Lamination process.